Trends in Automotive Connectivity, Automation, Greener Packaging

In order to ensure driving safety, the use of sensors is very important. Director Lin took the tire pressure sensor and airbag sensor in automobile sensors as examples and pointed out that the tire pressure sensor adopts the Film Assist Mold process, that is, it is molded during packaging, and the mold is directly pressed. On the chip, in order to avoid problems such as die crack, the design of the structure is very important. For example, the QFN package structure with Wettable Flank on the side can achieve good yield requirements.

By 2025, the compound annual growth rate of the vehicle market will reach 7%, and the sales of automotive semiconductors will reach 90 billion US dollars, which is 2.7 times the market growth rate. The electronics and electrification of automobiles are driving this development. main driving force. At the summit forum of China Integrated Circuit Design Innovation Conference and IC Application Expo (ICDIA 2022), Lin Shaoyu, Director of Engineering Integration Division of ASE Zhongli Plant, shared the packaging solutions and future development trends of automotive Electronic components.

Trends in Automotive Connectivity, Automation, Greener Packaging

Director Lin said that automotive design is developing towards safer, more energy-efficient and more comfortable directions. Automotive electronics means that the overall design architecture of the car has evolved from the traditional ECU separate control to a centralized high-efficiency processor. These high-efficiency processors need to be matched with More other chips like memory etc. Electrification is not just the iterative introduction of battery technology. The focus of automotive semiconductors in electrification is how to control power more efficiently, how to quickly achieve charging efficiency, and at the same time promote the growth of compound semiconductors, such as carbonizers.

Lidar and Radar

Self-driving AI continues to evolve, and the future of Level 5 fully autonomous driving is promising. Most car manufacturers believe that redundancy is an indispensable part of achieving Level 5 fully autonomous driving, and redundancy mainly refers to lidar and radar systems. Under the same technology iteration, lidar and radar cost one-fifth to one-tenth that of lidar, and the cost of lidar is still much higher than that of radar systems. Use deep learning and artificial intelligence to compare lidar and radar, map radar input to lidar output, and achieve low-cost radar to achieve the milestone of Level 5. In some models, the data collected by placing radar sensors and lidar sensors on the same vehicle to monitor the same environment proves that some lidar systems can be replaced by low-cost radar systems, which is also one of the important development trends of future automotive design. one.

Trends in Automotive Connectivity, Automation, Greener Packaging

Advanced Packaging for Automotive Applications

In the past, automotive semiconductors tended to use the mature traditional wire-bonding packaging process to achieve the goal of safety first, but in recent years, major breakthroughs have been made in the development of the industry, especially in the latest assisted driving technology and power semiconductor components. Applications in the automotive field are developing rapidly. For example, embedded package Embedded for power semiconductors, Fan Out package for radar use, Flip Chip BGA for processor development, will develop to 2.5D/3D IC package in the future, or higher Integrated system-in-package SiP and power Modules, these new forms of packaging will occupy an increasingly important position in automotive semiconductors.

Trends in Automotive Connectivity, Automation, Greener Packaging

Packaged in ADAS applications

In autonomous driving and assisted driving systems, the image sensor package must be controlled with a dust-free grade standard. Currently, Flip Chip BGA and Flip Chip CSP can perform fast calculations for image or signal processing. The main challenge of these two packages in the future is that when the circuit design becomes thinner and the integrated substrate gradually shrinks from 15*15 microns to 5*5 microns, Flip Chip BGA and Flip Chip CSP are prone to failure problems, and materials need to be improved. And the process to achieve the purpose of zero defect. In addition, for ADAS design, lidar must have a good design system, and the optical laboratory needs to do preliminary simulation. ASE is equipped with a very complete optical simulation laboratory to provide such services.

Trends in Automotive Connectivity, Automation, Greener Packaging

Smart Vision Sensing Simplifies ADAS Design

In order to ensure driving safety, the use of sensors is very important. Director Lin took the tire pressure sensor and airbag sensor in automobile sensors as examples and pointed out that the tire pressure sensor adopts the Film Assist Mold process, that is, it is molded during packaging, and the mold is directly pressed. On the chip, in order to avoid problems such as die crack, the design of the structure is very important. For example, the QFN package structure with Wettable Flank on the side can achieve good yield requirements.

Trends in Automotive Connectivity, Automation, Greener Packaging
High quality ensures driving safety

Application of mmWave in Smart Cockpit

In the smart cockpit technology, millimeter-wave radar can be used to realize a variety of intelligent sensing in the car, among which gesture detection as a new interaction method can control the temperature, lighting and opening and closing of windows in the car with just a wave of the hand. Gesture radar can be divided into two forms according to customer’s requirements for accuracy, one is Two Piece (PoP), and the other is One Piece. PoP can achieve higher accuracy and can be applied to convert entertainment systems, detect driver behavior, and more.

Trends in Automotive Connectivity, Automation, Greener Packaging

ASE’s advantages in the field of automotive electronic packaging

ASE provides solutions for all applications in automotive semiconductors, including SiC, system-in-package SiP, and highly customized sensors and power modules. Automotive design and packaging technology are more closely integrated, and are developing towards a more interconnected, more automatic, and more intelligent direction. ASE has more than 35 years of experience in the field of automotive IC packaging and module manufacturing. One-stop manufacturing services to modules, providing customers with maximum flexible design and technical support.

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