PCBA program appearance inspection

Reverse test:

The polarity point (white silkscreen) on the component is different from the direction of the PCB diode silkscreen (acceptable)
The polarity point (white silkscreen) on the component does not differ from the diode silkscreen on the PCB. (Reject)

Too much solder:

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The maximum height of the solder joint (E) can exceed the PAD or extend to the top of the metal plating of the end cap of the solderable end, but cannot extend to the component body (acceptable)
The solder has extended to the top of the component body. (Reject)


Anti-white phenomenon:

Chip components with exposed and stored electrical materials should be mounted on the chip parts with the material facing away from the printed surface. Only one component less than or equal to 0402 per Pcs board is allowed to be highlighted. (Acceptance)
Where there are exposed and stored electrical materials, chip components are mounted with the material surface facing the printed surface (rejected)
For Chip parts, each Pcs board does not allow two or more components ≤ 0402 to be highlighted.


Empty welding phenomenon:
The solder joints between the component pins and the PAD are good, moist and full, and the component pins are not warped (acceptable), and the component pins are not uniform (coplanar), which hinders the structure that can withstand soldering. (Reject)


Cold welding:

During the reflow process, the solder paste extends completely, and the tin on the solder joints is completely wet and shiny. (Acceptance)
The reflow of the solder paste on the solder ball is not complete, the appearance of the tin is dark and irregular, and the solder paste has tin powder that is not completely melted. (Reject)


Few pieces:

The BOM list requests a certain SMT placement number to place components but not many components (rejection):
The BOM list requests that a certain SMT placement number does not require placement components but components have been placed; in the center where they should not be, redundant parts are presented. (Reject)


Damaged parts:

Any edge peeling is less than 25% of the component width (W) or component thickness (T). The maximum metal plating loss on the top of the end is 50% (each end) (acceptable)
Any cracks or nicks that expose clicks; cracks, nicks, or any damage on the body of the glass element. Any gap in resistance material.
Any cracks or indentations. (Reject)


Foaming, layering:

The area of ​​blistering and delamination does not exceed 25% of the spacing between plated through holes or internal conductors. (Acceptance)
The area of ​​blistering and delamination exceeds 25% of the spacing between plated through holes or internal conductors. The blistering and delamination areas reduce the conductive pattern spacing to violate the minimum electrical gap. (Reject)

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Author: Chris Na

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