Dalian Daquanding Group launched an active noise-cancelling Bluetooth headset solution based on Qualcomm technology

The leading semiconductor component distributor dedicated to the Asia-Pacific market, Dalian General Holdings, announced that its subsidiary Quanding launched the Adaptive aptX+ANC active noise reduction Bluetooth headset solution based on Qualcomm’s QCC3044 AIT development board.

The leading semiconductor component distributor dedicated to the Asia-Pacific market, Dalian General Holdings, announced that its subsidiary Quanding launched the Adaptive aptX+ANC active noise reduction Bluetooth headset solution based on Qualcomm’s QCC3044 AIT development board.

According to Qualcomm’s latest consumer audio research report, more than one-third of respondents rely on their audio devices to help them relax, exercise, work, and stay connected with loved ones during the global pandemic. And 43% of respondents already own or are planning to buy true wireless headphones. And 71% of consumers surveyed said they are very interested in wireless headphones with high-quality sound.

Qualcomm’s next-generation stereo headsets and earbuds SoC platform and QCC3044 Bluetooth SoC combine powerful connectivity, ultra-long standby time, superior sound quality (Adaptive aptX), voice assistant and integrated ANC with features designed to enhance true wireless hearing experience.

Dalian Daquanding Group launched an active noise-cancelling Bluetooth headset solution based on Qualcomm technology
Figure 1 – The Display board of Dalian Daquanding’s active noise reduction Bluetooth headset solution based on Qualcomm technology

The biggest highlight in this solution is Qualcomm’s new generation of dynamically adjustable audio codec, Adaptive aptX, which is designed to provide a viable Bluetooth for wired audio equipment.® A wireless alternative for applications like music listening, video watching, and mobile gaming.

Dalian Daquanding Group launched an active noise-cancelling Bluetooth headset solution based on Qualcomm technology
Figure 2 – Block diagram of Dalian Daquanding’s active noise-cancelling Bluetooth headset solution based on Qualcomm technology

Its dynamic bitrate adaptive design ensures consistent and stable audio streaming in challenging RF environments, and the audio codec is backward compatible with aptX and aptX HD supported devices, a breakthrough ‘s new audio coding technology combines advanced audio quality, low bit rate audio delivery, low latency and scalability to create a superior wireless listening experience for end users.

Dalian Daquanding Group launched an active noise-cancelling Bluetooth headset solution based on Qualcomm technology
Figure 3 – The physical map of Dalian Daquanding’s active noise-cancelling Bluetooth headset based on Qualcomm technology

Core technical advantages:

• Bluetooth 5.2 version, more stable connection, lower latency and lower power consumption;
• Two-channel stereo output, suitable for TWS headphones and sports, headphone products;
• Support Qualcomm TrueWireless Mirroring, seamless switching technology;
• Qualcomm support® aptX™ and aptX HD Audio, and Adaptive aptX;
• Integrate Qualcomm’s third-generation ANC noise reduction function, with better noise reduction effect, including modes: Hybrid, Feedforward, and Feedback modes;
• Greater transmit power can improve Bluetooth distance, Maximum RF transmit power can reach 13dBm;
• Built-in 32Flash, no need for external memory chips, simplifying product design difficulty and cost.

Program Specifications:

• Compliant with Bluetooth v5.2 specification;
• Qualcomm TrueWireless Mirroring Stereo Earbuds;
• Always-on voice support;
• 120 MHz Kalimba™ audio DSP;
• 32 MHz developer processor for applications;
• High-performance 24-bit audio interface;
• Digital and analog microphone interfaces;
• Flexible PIO controller and LED pins with PWM support;
• Serial interface: UART, bit serializer (I²C/SPI), USB 2.0;
• Active Noise Cancellation: Hybrid, Feedforward and Feedback modes;
• aptX, aptX Adaptive and aptX HD Audio;
• 1 or 2 microphones Qualcomm® cVc™ headset voice processing;
• Integrated PMU: Dual SMPS for system/digital circuits, integrated Li-Ion battery charger;
• 90-ball 5.6 mm x 5.9 mm x 1.0 mm, 0.5 mm pitch VFBGA.

The Links:   LM190E08-TLGF 2MBI600VE-60-50