Siemens helps Chinese industry take a solid step towards digital transformation

·Appeared at the 2019 China International Industry Fair to fully Display one-stop product portfolio and services covering evaluation, consulting, integration, implementation and data services

·Jointly launched a new digital enterprise capability evaluation Model with CCID Lingxi to help enterprises accurately implement digitalization

Explore the industrial application prospects of cutting-edge technologies such as edge computing, artificial intelligence and additive manufacturing

Signed cooperation agreements with a number of companies to promote the digital transformation of pharmaceutical, chemical and other industries and the industrial application of additive manufacturing

Siemens unveiled at the 2019 China International Industry Fair with the theme of “Digital Enterprise – Thinking about the Future of Industry!”. At this expo, for the first time in China, Siemens fully demonstrated its one-stop product portfolio and services covering the entire cycle of enterprise digital transformation, covering assessment, consulting, integration, implementation and data services, to help enterprises of different scales and development stages solve Pain points and difficulties on the road of digital transformation help Chinese enterprises to implement digital transformation into reality. At the same time, Siemens demonstrated the application prospects of cutting-edge technologies such as edge computing, artificial intelligence, additive manufacturing and industrial 5G in the industrial field, opening up new possibilities in terms of efficiency and flexibility. Siemens has also signed cooperation agreements with a number of companies to help customers in the pharmaceutical, chemical and other industries continue to promote digital transformation, and jointly develop industrial applications of additive manufacturing with additive manufacturing equipment suppliers.

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The global industrial value chain is undergoing a new round of changes. China’s industry has unique advantages with its huge market scale, mature industrial ecology and high-quality talents, but it urgently needs to rely on digital technology to meet the market’s demand for customization, innovation speed and products. higher quality requirements. Wang Haibin, Executive Vice President of Siemens (China) Co., Ltd. and General Manager of Siemens Greater China Digital Industry Group, said: “Siemens can provide customers with a unique one-stop digital enterprise solution. With rich industrial software, the world’s leading industrial product portfolio and MindSphere, a cloud-based open IoT operating system, we are able to create digital twins for our customers covering the full value chain of product, production and performance for greater flexibility, higher productivity, and shorter time-to-market and better product quality, helping Chinese companies take a solid step towards digital transformation.”

During the exhibition, Siemens and CCID Lingxi, an intelligent manufacturing evaluation and consulting agency, jointly launched a new “Digital Enterprise Portrait” – the Digital Enterprise Portrait. A pre-release version of the model was first released in 2018, and nearly 3,000 evaluation reports have been generated to date. The upgraded “Digital Enterprise Profile” relies on Siemens’ digital transformation experience in supporting thousands of customers in different industries around the world and its own digital production and operation management system, combined with CCID’s intelligent manufacturing evaluation experience, from strategic planning, organizational management, system integration The six dimensions of , production management, data governance, and cutting-edge applications comprehensively evaluate the digital capabilities and development status of enterprises, and help enterprises accurately grasp the best entry point and action direction for digitalization.

The high complexity of digital transformation of industrial enterprises means that enterprises need to use professional digital consulting services to “tailor-made” to create customized digital transformation solutions. Based on strong technical expertise and industry experience, the Siemens digital consulting team decouples complex enterprise systems into multiple perspectives such as business processes, applications, data, and operations to ensure the effective advancement and implementation of digital transformation projects. During the exhibition, Siemens signed a strategic cooperation agreement with Nippon Paint Co., Ltd., which will provide comprehensive technical consulting services for the Nippon Paint Industrial Coatings Digital Factory Project and help it build a digital factory benchmark in China’s paint industry.

By exploring the convergence of cutting-edge technologies and product portfolios such as edge computing, artificial intelligence, additive manufacturing and industrial 5G, Siemens will help industrial companies benefit from rapidly growing data volumes in new and broader ways. Siemens and Hunan Farsoon High-Tech Co., Ltd. signed a strategic framework cooperation agreement on additive manufacturing during the exhibition. They will provide NX end-to-end software and digital twin solutions for fully integrated automation. The two parties will expand the industrial application of additive manufacturing. All-round cooperation in the scene.

During the exhibition, Siemens further expanded its cooperation with Chinese enterprises. Siemens and China National Pharmaceutical Group United Engineering Co., Ltd. signed an agreement on deepening strategic cooperation in the pharmaceutical industry. The two parties will carry out further in-depth cooperation in the exploration and practice of solutions in the pharmaceutical industry, and jointly create a practical example of “Industry 4.0” in the pharmaceutical industry. Siemens also signed a strategic cooperation agreement on TCM digital factory with Fatai (Tianjin) Technology Co., Ltd. to discuss the application of SIPAT in continuous manufacturing and the application scenarios of MindSphere in the TCM industry. At the same time, Siemens and Jiangsu Keruien Automation Technology Co., Ltd. signed a strategic cooperation agreement, and will build a digital platform for it through an advanced digital enterprise product portfolio and create a digital factory model project. Siemens also signed a strategic cooperation agreement with Cybernaut Investment Group.

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Cypress PSoC 6 BLE won the 2019 China IoT Technology Innovation Award

Shenzhen, December 23, 2019 – A few days ago, the 6th China IoT Conference 2019 with the theme of “New IoT Smart World” came to an end in Shenzhen. The conference is hosted by professional media electronics enthusiasts in the field of Electronic technology, and brings together industry elites in the field of Internet of Things to discuss opportunities for industrial innovation. At the same time, the selection results of the 4th China IoT Innovation Award were announced. Among them, Cypress semiconductor Technology Co., Ltd. (NASDAQ: CY) won the IoT Technology Innovation Award with its dual-core processing platform PSoC 6 BLE designed for IoT products.

It is reported that the selection of the IoT Technology Innovation Award comprehensively considers the innovative value of the participating products in the IoT-related product market, the competitive advantage compared with similar products of peers, and the role of improving key indicators of user products and improving user service quality. Through a review process that combines online real-name voting and expert review, products like PSoC 6 BLE, which are highly concerned and recognized by market and industry users, are selected from more than 100 participating products.

Cypress PSoC 6 BLE is the industry’s lowest power consumption, highest flexibility and built-in security function MCU, with high integration, seamless integration of IoT terminal applications key hardware security and connectivity functions, is widely used in wearable Product design for equipment, smart home, portable medical, IoT, smart industry.

Chen Guodong, Senior Marketing Manager of Cypress IoT Computing and Wireless Business Unit in China, took the stage to accept the award

Since the beginning of this year, the integration of 5G, artificial intelligence, blockchain and other technologies with the Internet of Things has accelerated. The global demand for reliable, safe and high-speed network connections and equipment has continued to grow, and the application scenarios of the Internet of Things have continued to expand. It is critical for the global semiconductor and electronics industries to seize the new growth opportunities presented by the Internet of Things.

As the world’s leading embedded solution provider, Cypress has already made IoT one of its key development directions and continues to make efforts. In March this year, Cypress launched a new series of PSoC 6 MCU products, PSoC 64 Secure MCU, which integrates system-level security software and hardware-level functions that follow security standards; in May, PSoC 6 MCU further strengthened its support for Alibaba The support for secure access to the cloud platform provides a strong security guarantee for IoT applications, especially connecting cloud services. In the future, Cypress will also be committed to providing IoT solutions with leading technology, excellent performance, covering hardware and software, helping users to strengthen the security of IoT applications and making IoT application design simpler.

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Embracing the new opportunities of the four super technical forces, Intel talks about the processor architecture in the E-class computing era

Processor architecture evolves with data, and we are currently in the midst of a data explosion led by four superpowers – ubiquitous computing, ubiquitous connectivity, artificial intelligence, and infrastructure from the cloud to the edge In this era, various types of data are generated every second, such as scalar, tensor, vector, spatial data, etc. To cope with these explosive growth of big data, what kind of processors will data centers need in the future?

On October 21st, at the 2021 CCF National High Performance Computing Academic Conference held in Zhuhai, Liang Yali, Vice President of Intel Corporation Marketing Group and General Manager of China Industry Solutions Department, shared the theme of “Accelerating Technology Leadership with High Performance Computing” Report. We can get a glimpse of the future processor architecture of the E-class data era from her sharing and other speaker reports.

  

Liang Yali, Vice President of Intel Corporation Marketing Group and General Manager of China Industry Solutions Department

Liang Yali said: “Today, the intelligence of everything is getting closer and closer to a reality. This is actually a huge change, but it has also led to an exponential increase in people’s computing and demand. Technology is becoming more and more important to all aspects of human life, and high Exascale computing power in the performance computing category is one of the most important infrastructures to support this change.”

  

She pointed out that Intel is not only a large-scale manufacturing company with both depth and breadth in software, chip and platform, packaging and process technology, but also a leading developer of semiconductor process technology. It has unique advantages in innovation and can be summarized as four “super technology forces” driving digital transformation:

The first is ubiquitous computing. In all fields of the world, computing has become a pervasive key factor that penetrates into all kinds of devices and all kinds of fields.

Second, ubiquitous connectivity. Whether it is a mobile phone, in fact, from Bluetooth to short-distance communication, to long-distance narrowband, 5G broadband, wired transmission, and the process of low-latency networking that is currently being developed and considered, various cities are all in order to make The realization that all devices can be ubiquitous, the connection between people, the connection between people and devices, and the connection between devices and devices has actually been slowly realized, which is the so-called connection upgrade.

Third, infrastructure from cloud to edge. Being able to build ubiquitous computing connections redefines a topology that will define the entire network.

Fourth, artificial intelligence. Among the extended network devices and structures, intelligence is the most prominent requirement. Although artificial intelligence is only one of the computing workloads, Intel proposed it separately because Intel believes that artificial intelligence will redefine the definition. The entire computing architecture and the entire computing process.

At the same time, each superpower will have its own characteristics and will complement each other to create new possibilities. Therefore, combining these four points, we can foresee that we will think about the bottom layer, technology, architecture, and evolution in the process of continuous evolution of the entire digital economy in the future. From these four points, we can also see that in the future, in the digital economy, it will definitely follow four laws, the first connection upgrade, the second thinking upgrade, the third experience upgrade, and the fourth security upgrade.

At the event, Intel invited Trish Damkroger, vice president of Intel’s accelerated computing system and graphics card group and general manager of the high-performance computing business unit, to share Intel’s response to the high-performance computing product line now and in the future by playing a video. these unprecedented challenges.

  

Trish Damkroger, Vice President, Accelerated Computing Systems and Graphics Group and General Manager, High Performance Computing Group, Intel Corporation

  

“Intel has been adding HPC-specific capabilities to its Xeon® processor roadmap for the past few years,” she said. “But for Intel to become a HPC leader, a shift to HPC-focused architectures is required. and system.”

  

The latest 3rd generation Intel released in April this year? Xeon? Scalable processors provide users with reliable performance and a high degree of flexibility, and bring a huge leap in performance to people’s high-performance computing systems. This is thanks to improvements in the processor’s core architecture, with a 20 percent increase in the number of instructions per clock, in addition to increased cache size. Intel also offers up to 40 cores and 8 memory channels, 3rd Gen Xeon? Scalable processors provide up to 6TB of system memory capacity. Xeon? The processor remains the only x86 processor in the data center with built-in AI acceleration, with built-in flexibility features. For example unique Intel? Speed ​​Select technology, which basically combines three CPUs into one, so people can use a single processor to meet more diverse needs.

Trish Damkroger also introduced us to Intel’s next-generation processor architecture, Sapphire Rapids, which will provide outstanding out-of-the-box performance and functionality for a variety of workloads, usage models, and deployment models in the data center. On the base server node, Sapphire Rapids introduces a new performance core microarchitecture with significantly improved IPC for excellent out-of-the-box performance and a number of new architectural features that dramatically improve data-parallel performance.

At the heart of Sapphire Rapids is a new modular SoC architecture that establishes next-generation scalability while maintaining the strong attributes of a balanced SoC that, despite being composed of multiple chip Modules, remains logically monolithic. Sapphire Rapids is the first Xeon product built using Silicon Bridge technology, which enables Intel to build highly scalable and well-balanced processors that have not been possible before.

  

Liang Yali said at the same time, “Technology has been integrated into everyone’s life, so different application scenarios correspond to different applications, different applications correspond to different workloads, and different workloads must have the most efficient computing system, and the future must be corresponding to XPU. If you need general-purpose computing, you can use CPU. If there is an acceleration scenario, you can use FPGA, ASIC chip, or the PAC we will release in the future. Different application loads will definitely have the most suitable and efficient system for it.”

This also proves why OneAPI is so important? “OneAPI is very important because we don’t want each system to correspond to different libraries, compilers and architectures. We want to have a framework that solves these problems and allows us to focus on the problems that should be focused most.”

In recent years, as high-performance computing has gradually become more and more industrial applications, its popularization and pervasiveness have also attracted more and more attention in the industry. For example, in the medical field, Intel is working with some industry partners to do cutting-edge “no-man’s-land” exploration. For this kind of “cross-border” attempt, Lu Gang, Center for Translational Medicine, Ruijin Hospital, introduced that on the one hand, we need talents with relatively specialized technical knowledge and background in bioinformatics, and at the same time, we need to have a very good understanding of HPC system architecture and technology. Clearly, such talent is very scarce. We and Intel have carried out in-depth cooperation in the design and construction of the entire platform. Intel’s technical strength and the professional capabilities of our experts in the field of bioinformatics can be well integrated, making our platform the first platform in the field of bioinformatics that can make breakthroughs in storage.

Looking ahead to the future of HPC development, Intel will not only provide a comprehensive product portfolio with capabilities ranging from general-purpose computing to specialized acceleration, to unique persistent memory and exascale computing distributed storage, high-performance interconnects, and innovative security. It will also work together with more ecological partners to make technologies work together seamlessly, thereby accelerating the popularization and universalization of HPC, and promoting HPC to bloom in more industries.

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Samsung Releases Exynos 990 5G: Super Capability Far Beyond Kirin 990 5G?

The Samsung Exynos 990 processor uses a new 5G modem, but it still needs to be paired with a new 5G baseband chip, the Exynos Modem 5123, to achieve 5G network support. The Exynos Modem 5123 is based on the 7nm EUV process. Officials say that it has a number of energy-saving optimizations, low power consumption under the 5G network, and effectively improves the battery life of the device.

The data shows that the Exynos Modem 5123 supports a maximum download speed of 7.35Gbps and a sub-6GHz download speed of up to 5.1Gpbs. Supports up to 3.0 Gpbs downlink speed and 422Mbps uplink speed in 4G LTE mode.

It is reported that Samsung Exynos 990 is based on 7nm EUV process, adopts dual-core fifth-generation Samsung custom core, and has dual-core Cortex A76 core and quad-core Cortex-A55 core at the same time. up to 10TOPs.

In terms of GPU, the SoC uses ARM’s new generation of Mali-G77 MP11. Official data say that the energy efficiency of this SoC is 20% higher than that of the Exynos 9820 Mali-G77 MP12.

In addition to the improvement of energy efficiency, the ISP of this SoC supports up to 6 independent sensors, and can process 3 sensors at the same time, and the single lens supports up to 108MP (100 million pixels).

In addition, Exynos 990 also supports LPDDR5 (2750MHz), 8K 30fps video encoding/decoding, 10bit HDR, 120Hz refresh rate and other features.

Finally, Samsung said that the Exynos 990 processor and the Exynos Modem 5123 chip will enter mass production by the end of this year, which means that mobile phones equipped with the Exynos 990 processor will appear early next year.

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Teledyne e2v introduces industry’s smallest 2- and 1.5-megapixel CMOS sensors featuring low-noise global shutter pixels

Grenoble, France, September 14, 2021 – Teledyne Technologies [NYSE:TDY] Teledyne e2v, a subsidiary of the group, launched the Topaz series of CMOS industrial sensors with 2 million and 1.5 million resolutions. Available in 1920 x 1080 and 1920 x 800 pixel formats, the new sensors use state-of-the-art low-noise, global shutter pixel technology to provide a robust solution for a variety of applications as well as a streamlined mobile design.

The Topaz sensor is housed in a 4.45 mm wide CSP package, where the optical center of the sensor perfectly coincides with the mechanical center of the package, resulting in a slim design for the camera. This feature makes it perfect for small OEM QR code engine designs, mobile terminals and SLEDs, IoT, contactless authentication systems, wearables, drones and robots. Small 2.5µm global shutter pixel applies intra-pixel correlated double sampling (CDS) and advanced dual light guides to ensure better signal-to-noise ratio and low crosstalk in low light conditions, so 1/3 inch can be achieved optical format.

Gareth Powell, Marketing Manager for CMOS Sensors at Teledyne e2v, said: “Modern logistics, retail and manufacturing applications all place higher demands on throughput, productivity and working range. The new Topaz sensor was developed based on this demand. Yes, it is very cost-effective and suitable for large-scale applications. It also has a small form factor and is the best choice for driving the world’s smallest QR code OEM engine and the thinnest mobile platform.”

Features:

Advanced 2.5μm x 2.5 μm global shutter pixel

Low read noise, typically 3 electrons

Excellent low-light signal-to-noise performance with short exposure times

Extremely low dark signal, maintaining excellent performance in high temperature environments

• In 8-bit output mode, the frame rate per second is greater than 100.

Dual MIPI outputs (2 Gpix/s each) for seamless connection with CPU, ISP and other application processors

Fast Wake Mode – decodes and wakes up other useful application functions within 10ms of power on

Product samples and evaluation kits are available now.

VISION will be held in Stuttgart, Germany from October 5-7, 2021, visit Teledyne booth 8B10 to learn more about Topaz.

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Improve battery life!Lithium battery inventor creates a new coating

The battery life of lithium batteries will be significantly lower after long-term use. This is largely due to impurities that form during battery cycling, and now a team led by the Nobel laureate and inventor of the rechargeable lithium battery may have found a solution to this problem – a new type of coating.

During lithium battery cycling, these impurities accumulate in the battery’s nickel-rich cathode. In lithium batteries, although nickel is the key to energy density, it is also unstable.

This resulted in the formation of impurities on the cathode surface during the first charge and discharge cycle, which in turn immediately reduced the battery’s storage capacity by 10 to 18 percent.

In addition, nickel creates instability beneath the surface of the cathode structure, which also begins to reduce the battery’s storage capacity over time.

In 2019, Stanley Whittingham and two other scientists were awarded the Nobel Prize in Chemistry for developing lithium-ion batteries in the 1970s.

The technology has come a long way since then, but researchers, including Whittingham, are still working to improve them by experimenting with different materials, and one promising material for a cathode is a nickel called NMC 811. Manganese cobalt material.

Led by Whittingham, a team of researchers from SUNY Binghamton, the Department of Energy, and Oak Ridge National Laboratory conducted multiple chemical studies of NMC 811.

Hopefully this will prevent instability in the cathode, which the researchers investigated through X-ray and neutron diffraction studies.

“Neutrons can easily penetrate the cathode material, revealing the positions of niobium and lithium atoms, which provides a better understanding of how the niobium modification process works,” said researcher Hui Zhou. Neutron scattering data suggest that niobium atoms are stable At higher temperatures, niobium atoms replace some of the manganese atoms deeper inside the cathode material to improve long-term capacity retention.”

Talking about this nickel-manganese-cobalt material reduces capacity loss during the first charge cycle. Later, it also provided better long-term performance, resulting in a capacity retention rate of 93.2% over 250 charge cycles.

Scientists see great potential in new battery designs, especially where high-density storage is a priority, such as in electric transport.

“Electrochemical performance and structural stability make NMC 811 a candidate cathode material for higher energy density applications such as electric vehicles,” Whittingham said. Combining niobium coatings with replacing manganese atoms with niobium atoms , may be a better way to improve initial capacity and long-term capacity retention. These modifications can be easily scaled up using the current multi-step fabrication process for NMC materials.”

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OPPO’s sub-brand is on the offensive, surpassing Samsung and approaching Xiaomi, and the Indian smartphone market is about to change

According to the data released by the market research agency Counterpoint in the third quarter of this year, Xiaomi continued to maintain its No. 1 position in the Indian smartphone market with a market share of 26%, which is the eighth consecutive quarter that it has maintained the No. However, what is worrying is that the OPPO sub-brand realme’s share in this market has surged. If the market share of the two is combined, the market share will reach 24%, surpassing Samsung and only 2 percentage points away from Xiaomi, showing realme’s attack. The power is quite fierce.

New changes in the Indian smartphone market

According to the data released by the market research agency Counterpoint, Xiaomi and Samsung ranked the top two in the Indian smartphone market with a market share of 26% and 20% respectively. This ranking has not changed since Xiaomi surpassed Samsung in the fourth quarter of 2017. .

Although the rankings of Xiaomi and Samsung did not change in the third quarter, there were bad signs. Xiaomi’s market share fell by 1 percentage point from 27% in the third quarter of last year, while Samsung’s market share fell by 3 percentage points, showing that they are losing market share to other mobile phone companies, and their competitive advantages have been significantly weakened.

It is vivo and OPPO that erode the market share of Xiaomi and Samsung. The data shows that vivo’s market share reached 17%, which is the highest record it has achieved in this market, an increase of 7 percentage points or 70% compared with the same period last year, a huge increase.

Next, let’s talk about the most surprising OPPO. OPPO’s market share was 8%, the same as the same period last year; but the growth of its sub-brand realme can be described as ferocious, increasing from 3% in the same period last year to 16%, with a market share of 16%. It has increased by more than 4 times, and the combined market share of the two has reached 24%, which is only 2 percentage points or 7.7% behind Xiaomi’s market share.

OV has grown rapidly to become Xiaomi’s dream

When OPPO and vivo entered the Indian market two years ago, they copied the offline channel Model obtained in the domestic market to the Indian market, giving Indian retail sales a huge profit share. The mobile phones sold are mainly 1,500 to 2,000 yuan. For mid-range models, this strategy was once a success. Vivo and OPPO quickly entered the top five in the Indian smartphone market, ranking third and fifth respectively.

After entering the Indian market in 2014, Xiaomi quickly won the fifth place, but it fell into a trough in 2016. After adjustment, it quickly revived in the market in 2017, and won the first place in the Indian smartphone market in the third quarter of 2017. At that time, Xiaomi mainly sold mobile phones in the Indian online market, but it learned the lessons of the domestic market and quickly developed into the Indian offline market after taking the lead in the Indian smartphone market. Offline retailers in India snapped up Xiaomi phones and sold them in offline markets.

As a result, Xiaomi mobile phones have also begun to threaten the position of OV in the Indian market, and the market reality is also the same. When Xiaomi mobile phones have been increasing in the Indian smartphone market share, OV’s share in the Indian smartphone market has once declined. In order to change the unfavorable situation, OPPO and vivo changed their strategies in 2017, reduced the profit sharing for Indian retailers, and began to enter the Indian online mobile phone market strongly in 2018.

Oppo and vivo have different approaches to India’s online mobile phone market. In the Indian market, vivo continued to sell cost-effective mobile phones under the vivo brand, while OPPO entered the Indian online mobile phone market with the realme brand, reaching prices below 1,500 yuan.

According to the shipments of the Indian smartphone market in the second quarter of this year given by the market research agency IDC, the shipments of OPPO and vivo have achieved rapid growth, increasing by 41% and 31.6% respectively. Shipments increased by more than six times year-on-year and entered the top five in the Indian smartphone market in one fell swoop. With the growth of OV shipments, Xiaomi’s shipments only increased by 4.8% year-on-year, and the growth rate was significantly lower than that of OV.

The data of the second quarter of this year shows that the combined market share of OPPO and realme has reached 17.4%, and the combined market share of the two in the third quarter has increased by 37.9% compared with the second quarter. The combined market share of the two will surpass that of Xiaomi next month, and the Indian smartphone throne will be reversed. The rapid growth of OPPO and realme is also bad news for Samsung. The combined market share of the two has surpassed Samsung, and Samsung has fallen to the third place. According to vivo’s growth momentum, it will likely surpass Samsung, and Samsung will be squeezed again. fell to fourth place.

The Indian market is very important to Xiaomi, OPPO, and vivo, because the Indian market is the largest overseas smartphone market, and because of their lack of intellectual property strength, entering the European market always faces the threat of patent litigation, which makes the Indian market even more important. In the face of the rapid growth of OV, Xiaomi may have to think about how to change its strategy to deal with their offensive.

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Dalian Daquanding Group launched an active noise-cancelling Bluetooth headset solution based on Qualcomm technology

The leading semiconductor component distributor dedicated to the Asia-Pacific market, Dalian General Holdings, announced that its subsidiary Quanding launched the Adaptive aptX+ANC active noise reduction Bluetooth headset solution based on Qualcomm’s QCC3044 AIT development board.

The leading semiconductor component distributor dedicated to the Asia-Pacific market, Dalian General Holdings, announced that its subsidiary Quanding launched the Adaptive aptX+ANC active noise reduction Bluetooth headset solution based on Qualcomm’s QCC3044 AIT development board.

According to Qualcomm’s latest consumer audio research report, more than one-third of respondents rely on their audio devices to help them relax, exercise, work, and stay connected with loved ones during the global pandemic. And 43% of respondents already own or are planning to buy true wireless headphones. And 71% of consumers surveyed said they are very interested in wireless headphones with high-quality sound.

Qualcomm’s next-generation stereo headsets and earbuds SoC platform and QCC3044 Bluetooth SoC combine powerful connectivity, ultra-long standby time, superior sound quality (Adaptive aptX), voice assistant and integrated ANC with features designed to enhance true wireless hearing experience.


Figure 1 – The Display board of Dalian Daquanding’s active noise reduction Bluetooth headset solution based on Qualcomm technology

The biggest highlight in this solution is Qualcomm’s new generation of dynamically adjustable audio codec, Adaptive aptX, which is designed to provide a viable Bluetooth for wired audio equipment.® A wireless alternative for applications like music listening, video watching, and mobile gaming.


Figure 2 – Block diagram of Dalian Daquanding’s active noise-cancelling Bluetooth headset solution based on Qualcomm technology

Its dynamic bitrate adaptive design ensures consistent and stable audio streaming in challenging RF environments, and the audio codec is backward compatible with aptX and aptX HD supported devices, a breakthrough ‘s new audio coding technology combines advanced audio quality, low bit rate audio delivery, low latency and scalability to create a superior wireless listening experience for end users.


Figure 3 – The physical map of Dalian Daquanding’s active noise-cancelling Bluetooth headset based on Qualcomm technology

Core technical advantages:

• Bluetooth 5.2 version, more stable connection, lower latency and lower power consumption;
• Two-channel stereo output, suitable for TWS headphones and sports, headphone products;
• Support Qualcomm TrueWireless Mirroring, seamless switching technology;
• Qualcomm support® aptX™ and aptX HD Audio, and Adaptive aptX;
• Integrate Qualcomm’s third-generation ANC noise reduction function, with better noise reduction effect, including modes: Hybrid, Feedforward, and Feedback modes;
• Greater transmit power can improve Bluetooth distance, Maximum RF transmit power can reach 13dBm;
• Built-in 32Flash, no need for external memory chips, simplifying product design difficulty and cost.

Program Specifications:

• Compliant with Bluetooth v5.2 specification;
• Qualcomm TrueWireless Mirroring Stereo Earbuds;
• Always-on voice support;
• 120 MHz Kalimba™ audio DSP;
• 32 MHz developer processor for applications;
• High-performance 24-bit audio interface;
• Digital and analog microphone interfaces;
• Flexible PIO controller and LED pins with PWM support;
• Serial interface: UART, bit serializer (I²C/SPI), USB 2.0;
• Active Noise Cancellation: Hybrid, Feedforward and Feedback modes;
• aptX, aptX Adaptive and aptX HD Audio;
• 1 or 2 microphones Qualcomm® cVc™ headset voice processing;
• Integrated PMU: Dual SMPS for system/digital circuits, integrated Li-Ion battery charger;
• 90-ball 5.6 mm x 5.9 mm x 1.0 mm, 0.5 mm pitch VFBGA.

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Diagram of the principle of ultrasonic technology, what are the advantages of applying it to UAV landing?

UAV landing assist is a function of the UAV, which can detect the distance between the bottom of the UAV and the landing area, determine whether the landing point is safe, and then slowly descend to the landing area. While GPS monitoring, barometric pressure sensing, and other sensing technologies aid in the landing process, ultrasonic sensing is the primary and most accurate judgement for the drone during this process. There are also hover and ground tracking modes in most drones, mostly for capturing footage and land navigation, where ultrasonic sensors help keep the drone at a constant altitude above the ground.

Principle of Ultrasound

Ultrasound is defined as the use of sound waves above the upper limit of human hearing – see Figure 1.

Figure 1: Ultrasonic Range

Ultrasonic waves can pass through various media (gas, liquid, solid) to detect objects with mismatched acoustic impedance. The speed of sound is the distance per unit time that a sound wave travels in an elastic medium. For example, in dry air at 20°C (68°F), the speed of sound is 343 meters per second (1,125 feet per second). Ultrasonic attenuation in air increases with frequency and humidity. Therefore, air-coupled ultrasound is generally limited to frequencies below 500 kHz due to excessive path loss/absorption.

Ultrasonic ToF

Like many ultrasonic sensing applications, drone landing assistance systems use the time-of-flight (ToF) principle. ToF is an estimate of the round-trip time of the ultrasonic waves emitted from the sensor to the target object and then reflected from the object back to the sensor, as shown in Figure 2.

Figure 2: Schematic diagram of ultrasonic ToF for drone landing

At point 1 in Figures 2 and 3, the drone’s ultrasonic sensor emits a sound wave, which is represented as saturated data on the return signal processing path. After sending, the signal processing path is muted (point 2) until the echo bounces off the object (point 3).

Figure 3: Phase of Ultrasonic ToF

Equation 1 calculates the distance from the drone to the ground or from the drone to another object:

 

Distance (d) is the distance from the ultrasonic sensor on the drone to the ground/object, ToF

Why use ultrasonic sensing for drone landings?

While numerous sensing techniques can detect the proximity of objects, ultrasonic sensing works well in terms of detection distance, cost of the solution, and reliability on different surfaces when the drone lands.

A common requirement for ground tracking and landing of drones is the ability to reliably detect distances up to 5 meters above the ground. Ultrasonic sensors in the 40-60kHz range can usually meet this range, assuming proper signal conditioning and processing.

Texas Instruments’ PGA460 is an ultrasonic signal processor and sensor driver for ultrasonic sensing in air-coupled applications such as drones that meet or exceed the 5-meter requirement. However, the coordination of ultrasonic sensing is a limitation in the near-field detection of objects. All ultrasonic sensors used in air-coupled applications have an excitation period, called the decay time or oscillation time, during which the piezoelectric film vibrates and emits ultrasonic energy, making it difficult to detect any incoming echoes.

To effectively measure objects during ringing, many drone designers install separate sensors for the transmitter and receiver. By separating the receiver, the drone can detect objects during excitation from the transmitter. So the PGA460 has superior near field detection performance – down to 5cm or less.

Ultrasonic sensing technology is also a cost-competitive technology, especially when using integrated solutions such as the PGA460, which already includes most of the required chips. The PGA460 can drive sensors either directly using a half- or H-bridge, or using a transformer; the latter is primarily used for hermetically sealed “hermetic” sensors. The PGA460 also includes a complete analog front end for receiving and conditioning ultrasound echoes. In addition, the device can calculate ToF through digital signal processing (see Figure 4).

Figure 4: PGA460 functional block diagram

Ultrasonic sensing can detect surfaces that are difficult to solve with other techniques. For example, drones often encounter glazing and other glass surfaces on buildings. Light-sensing technology sometimes passes through glass and other transparent materials, making it difficult for drones to hover over glass buildings. Ultrasonic waves are reliably reflected off the glass surface.

While ultrasonic sensing is primarily used for drone landing assistance and hovering, its robust price/performance ratio is prompting drone designers to explore other applications for the technology. The rapidly growing field of drones has enormous potential.

The Links:   BAS7006TC CM400DY-24A

Do you understand the coding principle and position measurement of the encoder?

The encoder is like human eyes. It cooperates with automation software to know the current position of the motor shaft or load. In industry, photoelectric encoders are generally used. The following is a brief description.

The encoder is like human eyes. It cooperates with automation software to know the current position of the motor shaft or load. In industry, photoelectric encoders are generally used. The following is a brief description.

The photoelectric encoder is on a thin and light disc, which is corroded and carved with many tiny gaps by precision instruments. It is equivalent to dividing a 360 degree into many equal parts, such as 1024 groups, so that the angle difference between each group is 360/1024 degrees = 0.3515625 degrees.

Then there is a precise light source, mounted on one side of the code wheel, and there will be a receiver on the other side of the code wheel. It is composed of photoresistor and amplifying and shaping circuit. When the code disc rotates, the gap passes through. The receiver receives the light pulse instantaneously, and outputs the electrical pulse signal after the circuit processing, so that the code disc rotates one circle, it will output 1024 pulses, if the first pulse position is 0, the second pulse position is 0.3515625°, the third pulse position is 0.3515625°, The pulse position is 0.3515625°*2.


(The picture comes from the electrician’s home, the same below)

In this way, as long as the instrument can read the number of pulses, it can know the corresponding position of the encoder. If the encoder is installed on the motor shaft, the motor shaft and the encoder are rigidly connected, and the positional relationship between them will be in one-to-one correspondence. By reading the encoder pulses, the position of the motor shaft can be known.

The motor shaft, for example, will drive some loads, such as control screws, through synchronous belts, gears, chains, etc. This is the so-called Electronic transmission ratio relationship. How many millimeters the screw will move forward when the motor makes one revolution. In this way, the number of pulses output by the corresponding encoder can be read. From the number of pulses, the current position of the screw can be inferred.

But the encoder is circular, and if it rotates infinitely, the angle will be infinite, so an incremental encoder is designed. For each revolution, three groups of signals ABZ are output, of which AB is the same pulse. For example, there are 1024 pulses in a circle mentioned above. The AB phase pulse corresponds to a rounded corner in a circle, and the two pulses are in quadrature. If it is positive or negative, we can judge whether the encoder rotates clockwise or counterclockwise by judging the rising and falling sequence of the AB phase pulse.

Also, there is a Z-phase pulse, because while the circle continues to rotate and the angle is infinite, they repeat every week. The zero-phase pulse is fixed at a certain position of the circle, and the encoder only outputs one zero-phase pulse per revolution.

Therefore, taking the Z-phase pulse as the reference point, the system can control the maximum angle within 360° by reading one pulse each time, which is equivalent to a zero reference point.

In this way, even if the system is disconnected and powered on again, as long as the reference point can be found, the initial position of the lead screw can be known.

The above positioning is called an incremental coordinate system, so the encoder is an incremental encoder.

In addition, the encoder has a magnetoelectric mode. For example, many small magnets spaced north and south are handled on the encoder. The signal is read out by the Hall, and the output signal is also amplified and shaped into electrical pulses. This is similar to the photoelectric encoder, the price will be cheaper, the reliability will be higher, but the accuracy will be worse than the photoelectric encoder.

The Links:   FF300R17KE3 SKKT200/18E

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